US 12,447,725 B2
Curable resin multilayer body, dry film, cured product and electronic component
Shoko Mishima, Hiki-gun (JP); Shoya Sekiguchi, Hiki-gun (JP); Kota Oki, Hiki-gun (JP); and Nobuhiro Ishikawa, Hiki-gun (JP)
Assigned to TAIYO HOLDINGS CO., LTD., Hiki-gun (JP)
Appl. No. 18/552,743
Filed by TAIYO HOLDINGS CO., LTD., Hiki-gun (JP)
PCT Filed Mar. 31, 2022, PCT No. PCT/JP2022/016760
§ 371(c)(1), (2) Date Sep. 27, 2023,
PCT Pub. No. WO2022/211071, PCT Pub. Date Oct. 6, 2022.
Claims priority of application No. 2021-062055 (JP), filed on Mar. 31, 2021; application No. 2021-062056 (JP), filed on Mar. 31, 2021; and application No. 2021-062057 (JP), filed on Mar. 31, 2021.
Prior Publication US 2024/0165934 A1, May 23, 2024
Int. Cl. B32B 27/28 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); C08L 71/12 (2006.01)
CPC B32B 27/285 (2013.01) [B32B 27/08 (2013.01); B32B 27/20 (2013.01); C08L 71/12 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2264/1021 (2020.08); B32B 2307/204 (2013.01); B32B 2307/206 (2013.01); B32B 2307/732 (2013.01); B32B 2371/00 (2013.01); B32B 2457/08 (2013.01)] 6 Claims
 
1. A curable resin laminate, comprising:
a first resin layer including a first curable composition comprising a polyphenylene ether and a filler; and
a second resin layer including a second curable composition and laminated on at least one surface of a main surface of the first resin layer,
wherein the second resin layer has a thickness in a range of 5 to 35% relative to a total thickness of the first resin layer and the second resin layer, the filler in the first curable composition of the first resin layer has a content of 30% by mass or more relative to a total solid content in the first curable composition, the second curable composition includes a polyphenylene ether and does not contain a filler or includes a filler in a content of 40% by mass or less relative to a total solid content in the second curable composition such that the content of the filler in the first curable composition and the content of the filler in the second curable composition satisfy a relationship MB1>MB2, where MB1 is the content of the filler in the first curable composition and MB2 is the content of the filler in the second curable composition, and the polyphenylene ether in the first curable composition and the polyphenylene ether in the second curable composition are polyphenylene ethers obtained from raw material phenols including phenols having hydrogen atoms at ortho and para positions and having a slope of less than 0.6 calculated by a conformation plot.