US 12,447,716 B2
Radiative cooling device and radiative cooling method
Masahiro Suemitsu, Osaka (JP)
Assigned to Osaka Gas Co., Ltd., Osaka (JP)
Appl. No. 17/910,646
Filed by Osaka Gas Co., Ltd., Osaka (JP)
PCT Filed Mar. 8, 2021, PCT No. PCT/JP2021/008966
§ 371(c)(1), (2) Date Sep. 9, 2022,
PCT Pub. No. WO2021/182387, PCT Pub. Date Sep. 16, 2021.
Claims priority of application No. 2020-043486 (JP), filed on Mar. 12, 2020.
Prior Publication US 2023/0150237 A1, May 18, 2023
Int. Cl. B32B 7/023 (2019.01); F24S 70/225 (2018.01); F24S 70/275 (2018.01); F24S 70/60 (2018.01); F28F 13/02 (2006.01)
CPC B32B 7/023 (2019.01) [F24S 70/225 (2018.05); F24S 70/275 (2018.05); F24S 70/60 (2018.05); F28F 13/02 (2013.01); B32B 2307/30 (2013.01); B32B 2307/416 (2013.01); B32B 2307/71 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A radiative cooling device comprising:
an infrared radiative layer configured to radiate infrared light from a radiative surface;
a light reflective layer disposed on a side opposite to the radiative surface with respect to the infrared radiative layer; and
a protective layer disposed between the infrared radiative layer and the light reflective layer, and
wherein:
the infrared radiative layer is a resin material layer that has a thickness adjusted so as to emit a heat radiation energy greater than an absorbed solar energy in a wavelength range from 8 μm to 14 μm,
the light reflective layer contains silver or a silver alloy, and
the protective layer is formed from a polyolefin based resin with a thickness of 300 nm or more and 40 μm or less or an ethylene terephthalate resin with a thickness of 17 μm or more and 40 μm or less.