US 12,447,671 B2
Three-dimensional shaping method
Keitaro Hashizume, Shiojiri (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jul. 11, 2023, as Appl. No. 18/350,670.
Claims priority of application No. 2022-112322 (JP), filed on Jul. 13, 2022.
Prior Publication US 2024/0017480 A1, Jan. 18, 2024
Int. Cl. B33Y 10/00 (2015.01); B29C 64/141 (2017.01)
CPC B29C 64/141 (2017.08) [B33Y 10/00 (2014.12); B29K 2995/0012 (2013.01); B29K 2995/0049 (2013.01); B29K 2995/0077 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A three-dimensional shaping method of shaping a three-dimensional shaped article using a first material including first resin and a second material including second resin having a heat shrinkage rate different from a heat shrinkage rate which the first resin has, the method comprising:
stacking, when preparing a first slice layer formed of one of the first material and the second material, and stacking a second slice layer formed of another of the first material and the second material on the first slice layer, a first boundary layer formed of the one of the first material and the second material on the first slice layer;
stacking a second boundary layer formed of the another of the first material and the second material on the first boundary layer; and
stacking the second slice layer on the second boundary layer, wherein
the first boundary layer is a layer provided with a plurality of voids formed inside a contour of the first boundary layer when viewing the first boundary layer from a stacking direction of the first slice layer and the second slice layer.