| CPC B29C 59/022 (2013.01) [B29C 59/002 (2013.01); G06V 10/145 (2022.01); G06V 10/22 (2022.01); G06V 2201/07 (2022.01)] | 12 Claims |

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1. An imprint device that performs an imprinting process in which a mold on which a pattern is formed is brought in contact with an imprint material on a substrate and the pattern is transferred to the substrate at a target position on the substrate, the imprint device comprising:
a mold holding unit configured to hold the mold that also includes an alignment mark and a pattern mark disposed closer to the pattern of the mold than the alignment mark;
a substrate holding unit configured to hold the substrate;
a radiation unit configured to radiate light to the imprint material to cure the imprint material;
a control unit configured to:
perform alignment by controlling positions of at least one of the mold holding unit or the substrate holding unit based on an amount of relative positional deviation between the pattern mark and the alignment mark; and
control the radiation unit to radiate light to the imprint material an alignment position to cure the imprint material after performing the alignment,
wherein the pattern of the mold and the pattern mark of the mold are formed on the mold at the same timing, and
wherein the pattern of the mold and the alignment mark of the mold are formed on the mold at different timings.
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10. An imprint method of performing an imprinting process in which a mold on which a pattern is formed is brought in contact with an imprint material on a substrate and the pattern is transferred to the substrate at a target position on the substrate, wherein the mold is held by a mold holding unit and the substrate is held by the substrate holding unit, and wherein the mold further includes an alignment mark and a pattern mark disposed closer to the pattern of the mold than the alignment mark, the imprint method comprising:
performing alignment by controlling positions of at least one of the mold holding unit or the substrate holding unit based on an amount of relative positional deviation between the pattern mark and the alignment mark; and
controlling a radiation unit to radiating light to the imprint material at an alignment position to cure the imprint material after performing the alignment,
wherein the pattern of the mold and the pattern mark of the mold are formed on the mold at the same timing, and
wherein the pattern of the mold and the alignment mark of the mold are formed on the mold at different timings.
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11. An article manufacturing method comprising:
bringing a mold on which a pattern is formed in contact with an imprint material on a substrate and performing imprinting by transferring the pattern to the substrate at a target position on the substrate, wherein the mold is held by a mold holding unit and the substrate is held by the substrate holding unit, and wherein the mold further includes an alignment mark and a pattern mark disposed closer to the pattern of the mold than the alignment mark;
performing alignment by controlling positions of at least one of the mold holding unit or the substrate holding unit based on an amount of relative positional deviation between the pattern mark and the alignment mark;
controlling a radiation unit to radiating light to the imprint material at an alignment position to cure the imprint material after performing the alignment; and
forming the pattern on the substrate in the imprinting and then processing the substrate on which the pattern is formed,
wherein the pattern of the mold and the pattern mark of the mold are formed on the mold at the same timing, and
wherein the pattern of the mold and the alignment mark of the mold are formed on the mold at different timings.
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12. A non-transitory computer-readable storage medium storing a computer program executable by a computer to execute an imprint method comprising:
bringing a mold on which a pattern is formed in contact with an imprint material on a substrate and performing imprinting by transferring the pattern to the substrate at a target position on the substrate, wherein the mold is held by a mold holding unit and the substrate is held by the substrate holding unit, and wherein the mold further includes an alignment mark and a pattern mark disposed closer to the pattern of the mold than the alignment mark;
performing alignment by controlling positions of at least one of the mold holding unit or the substrate holding unit based on an amount of relative positional deviation between the pattern mark and the alignment mark; and
controlling a radiation unit to radiating light to the imprint material at an alignment position to cure the imprint material after performing the alignment,
wherein the pattern of the mold and the pattern mark of the mold are formed on the mold at the same timing, and
wherein the pattern of the mold and the alignment mark of the mold are formed on the mold at different timings.
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