US 12,447,582 B2
Chemical mechanical polishing pad with fluorinated polymer and multimodal groove pattern
Matthew R. Gadinski, Newark, DE (US); and Joseph So, Wilmington, DE (US)
Assigned to Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed by Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed on Feb. 14, 2023, as Appl. No. 18/168,621.
Application 18/168,621 is a continuation in part of application No. 18/145,584, filed on Dec. 22, 2022, abandoned.
Prior Publication US 2024/0207998 A1, Jun. 27, 2024
Int. Cl. B24B 37/24 (2012.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01)
CPC B24B 37/24 (2013.01) [B24B 37/22 (2013.01); B24B 37/26 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A polishing pad suitable for chemical mechanical polishing comprising:
a polishing layer including a polyurea having a soft phase and a hard phase, the soft phase being a copolymer of aliphatic fluorine-free species and a fluorinated aliphatic species, and hard phase being formed from diisocyanate containing segments and an amine curative agent,
wherein the polishing layer has a top surface having a groove pattern,
the groove pattern comprises a plurality of first grooves having a first groove cross-section, the plurality of first grooves defining a plurality of regions between adjacent first grooves; and, in a portion of the plurality of region between adjacent first grooves, a plurality of second grooves having a second groove cross-section, wherein the second groove cross-section is less than 50 percent of the first groove cross-section,
wherein the polishing layer is further characterized by having a specific gravity of at least 1.05 grams per cubic centimeter.