US 12,447,581 B2
Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
Bainian Qian, Newark, DE (US); Donna M. Alden, Bear, DE (US); and Sheng-Huan Tseng, Zhubei (TW)
Assigned to Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed by Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed on Jul. 11, 2022, as Appl. No. 17/811,624.
Prior Publication US 2024/0009798 A1, Jan. 11, 2024
Int. Cl. B32B 37/22 (2006.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24D 3/00 (2006.01); B32B 37/24 (2006.01)
CPC B24B 37/22 (2013.01) [B24B 37/24 (2013.01); B24D 3/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A polishing pad for chemical mechanical polishing comprising:
a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate terminated prepolymer with a curative, wherein the polymer matrix has hard segments and soft segments wherein multi-lobed polymeric elements formed from pre-expanded polymeric microspheres are present in the polymer matrix and wherein the multi-lobed polymeric elements are deflated residues of the pre-expanded polymeric microspheres and wherein the polishing layer further comprises pores formed by a portion of the pre-expanded polymeric microspheres that retain a shape that is substantially spherical or ellipsoid and 0.1 to 20 percent of the pre-expanded polymeric microspheres form the multi-lobed polymeric elements.