US 12,447,576 B2
Compensation for slurry composition in in-situ electromagnetic inductive monitoring
Kun Xu, Sunol, CA (US); and Andrew Siordia, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 31, 2023, as Appl. No. 18/240,587.
Application 18/240,587 is a continuation of application No. 17/122,819, filed on Dec. 15, 2020, granted, now 11,794,302.
Prior Publication US 2024/0123565 A1, Apr. 18, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); G01B 7/06 (2006.01)
CPC B24B 37/005 (2013.01) [B24B 37/042 (2013.01); B24B 37/10 (2013.01); G01B 7/10 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A computer program product tangibly comprising a non-transitory computer readable storage medium comprising instructions to cause a computer system to:
store a polishing liquid signal contribution value representing a contribution of a polishing liquid to signals generated by an in-situ electromagnetic induction monitoring system, manifested by a change to an impedance formed by a circuit of the in-situ electromagnetic induction monitoring system during polishing of a substrate in a presence of the polishing liquid;
receive a sequence of signal values from a sensor of the in-situ electromagnetic induction monitoring system as a conductive layer of the substrate is polished in the presence of the polishing liquid in a polishing system;
determine a sequence of thickness values for the conductive layer based on the sequence of signal values manifested by the change to the impedance from the sensor of the in-situ electromagnetic induction monitoring system and the polishing liquid signal contribution value; and
adjust a polishing parameter of the polishing system based on the sequence of thickness values to modify polishing of the substrate.