US 12,447,569 B2
Systems and methods for automated extraction of hardware from printed circuit boards
Benjamin Caleb Cartwright, San Gabriel, CA (US)
Filed by Semsotai USA Inc., Brea, CA (US)
Filed on Nov. 30, 2024, as Appl. No. 18/964,349.
Claims priority of provisional application 63/604,483, filed on Nov. 30, 2023.
Prior Publication US 2025/0178142 A1, Jun. 5, 2025
Int. Cl. B23P 19/06 (2006.01)
CPC B23P 19/06 (2013.01) 21 Claims
OG exemplary drawing
 
1. A method for extracting one or more hardware pieces from a printed circuit board using (i) a robotic arm having a cutting tool at a free end, (ii) a camera, and (iii) a conveyance system for conveying said printed circuit board and said one or more hardware pieces, said method comprising the steps of:
a) receiving said printed circuit board;
b) conveying said printed circuit board toward said robotic arm;
c) capturing at least one circuit board image using said camera;
d) from said at least one image, identifying a first hardware piece and said printed circuit board;
e) moving said free end of said robotic arm toward said printed circuit board;
f) activating a hardware engagement mechanism of said robotic arm to engage said first hardware piece;
g) piercing said printed circuit board with said cutting tool adjacent to said first hardware piece;
h) moving said cutting tool around said first hardware piece until a first extracted portion of said printed circuit board with said first hardware piece is removed from a first residual portion of said printed circuit board; and
i) disactivating said hardware engagement mechanism to release said first extracted portion.