	US 12,447,564 B2
	Solder alloy, solder ball, and solder joint
Yuuki Iijima, Tokyo (JP); Hiroshi Okada, Tokyo (JP); Shunsaku Yoshikawa, Tokyo (JP); Takashi Saito, Tokyo (JP); Kanta Dei, Tokyo (JP); and Takahiro Matsufuji, Tokyo (JP)
Assigned to Senju Metal Industry Co., Ltd., Tokyo (JP)
Appl. No. 17/912,384
Filed by Senju Metal Industry Co., Ltd., Tokyo (JP)
PCT Filed Mar. 10, 2021, PCT No. PCT/JP2021/009530 § 371(c)(1), (2) Date Sep. 16, 2022, PCT Pub. No. WO2021/187271, PCT Pub. Date Sep. 23, 2021.
Claims priority of application No. 2020-048691 (JP), filed on Mar. 19, 2020.
Prior Publication US 2023/0129147 A1, Apr. 27, 2023
Int. Cl. C22C 13/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01)

CPC B23K 35/262 (2013.01) [B23K 35/0244 (2013.01); C22C 13/00 (2013.01)]

18 Claims

1. A solder alloy having an alloy composition consisting of, by mass %:

Ag: 0.8 to 1.5%,

Cu: 0.1 to 1.0%,

Ni: 0.01 to 0.10%, and

P: 0.006% to 0.009%, with the balance being Sn.