US 12,447,513 B2
Gas cabinet with reduced gas emissions and exhaust flow rate
Ronald Nasman, Albany, NY (US)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Sep. 28, 2023, as Appl. No. 18/374,406.
Prior Publication US 2025/0108418 A1, Apr. 3, 2025
Int. Cl. B08B 15/02 (2006.01); H01L 21/67 (2006.01)
CPC B08B 15/023 (2013.01) [H01L 21/67017 (2013.01); B08B 2215/003 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A gas cabinet, comprising:
an enclosure configured to contain at least one gas vessel and associated gas distribution components within an interior of the enclosure, wherein the at least one gas vessel contains a process gas used in semiconductor manufacturing;
an exhaust port arranged near a top of the enclosure, wherein an exhaust ventilation system is coupled to the exhaust port to create a negative pressure within the interior of the enclosure;
an air intake vent having a first plurality of openings, wherein the negative pressure created by the exhaust ventilation system draws ambient air from outside of the enclosure into the interior of the enclosure through the first plurality of openings provided within the air intake vent to create an airflow through the interior of the enclosure that sweeps any process gas, which leaks from the at least one gas vessel or the associated gas distribution components, up to the exhaust port where it is exhausted into the exhaust ventilation system at an exhaust flow rate; and
an air plenum mounted within the interior of the enclosure directly behind the air intake vent, wherein the air plenum provides a longer airflow path from the outside of the enclosure into the interior of the enclosure, wherein the longer airflow path provided by the air plenum is fixed and not adjustable, and wherein the longer airflow path reduces a diffusion of the any process gas outside of the enclosure and/or enables the exhaust flow rate of the exhaust ventilation system to be reduced.