US 12,447,507 B2
Wafer back surface cleaning device
Junichi Fukushima, Hachioji (JP)
Assigned to TOKYO SEIMITSU CO., LTD., Tokyo (JP)
Appl. No. 18/283,186
Filed by TOKYO SEIMITSU CO., LTD., Hachioji (JP)
PCT Filed Dec. 14, 2021, PCT No. PCT/JP2021/045925
§ 371(c)(1), (2) Date Sep. 20, 2023,
PCT Pub. No. WO2022/201666, PCT Pub. Date Sep. 29, 2022.
Claims priority of application No. 2021-052536 (JP), filed on Mar. 26, 2021.
Prior Publication US 2024/0173750 A1, May 30, 2024
Int. Cl. B08B 1/32 (2024.01); B08B 1/14 (2024.01); B08B 1/36 (2024.01); B08B 3/02 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01)
CPC B08B 1/14 (2024.01) [B08B 1/143 (2024.01); B08B 1/36 (2024.01); B08B 3/02 (2013.01); B08B 1/32 (2024.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A wafer back surface cleaning device that cleans a back surface of a wafer, the wafer back surface cleaning device comprising:
a first hand that receives the wafer that has been cleaned;
a second hand that holds the wafer with its front surface directed upward, conveys the wafer before cleaning to a cleaning position, and transfers the wafer after cleaning to the first hand;
a rotatable rotation plate provided at the cleaning position;
a cleaning pad capable of rotating integrally with the rotation plate, and capable of contacting the back surface of the wafer by sliding arrangement to the cleaning position; and
a cleaning water supply nozzle capable of rotating integrally with the rotation plate, and the cleaning water supply nozzle discharges cleaning water to the back surface of the wafer at the cleaning position,
wherein the second hand brings the back surface of the wafer into contact with the cleaning pad with the cleaning water supply nozzle supplying the cleaning water to the back surface of the wafer in scrub cleaning, separates the wafer after the scrub cleaning from the cleaning pad with the cleaning water supply nozzle supplying the cleaning water to the back surface of the wafer in rinse cleaning, and transfers the wafer to the first hand after the rinse cleaning,
whereby in scrub cleaning, the cleaning pad and the cleaning water supply nozzle rotate with the rotation plate, the cleaning pad is pressed against the back surface of the wafer, and the cleaning water supply nozzle discharges the cleaning water toward the back surface of the wafer.