US 12,446,795 B2
Enclosure for a wireless implantable device with embedded power source
Andrew DeHennis, Germantown, MD (US); Abhi Chavan, Germantown, MD (US); James Masciotti, Germantown, MD (US); Bryan Hays, Germantown, MD (US); Yahya Hosseini, Germantown, MD (US); and Erman Citirik, Germantown, MD (US)
Assigned to Senseonics, Incorporated, Germantown, MD (US)
Filed by Senseonics, Incorporated, Germantown, MD (US)
Filed on Mar. 24, 2021, as Appl. No. 17/211,251.
Claims priority of provisional application 62/994,809, filed on Mar. 25, 2020.
Prior Publication US 2021/0298634 A1, Sep. 30, 2021
Int. Cl. A61B 5/07 (2006.01); A61B 5/00 (2006.01); A61B 5/145 (2006.01)
CPC A61B 5/076 (2013.01) [A61B 5/686 (2013.01); A61B 5/14503 (2013.01); A61B 2562/12 (2013.01)] 30 Claims
OG exemplary drawing
 
25. A method of manufacturing an implantable device, the method comprising:
placing circuitry at least partially within a housing;
adding a first material to the housing;
after placing the circuitry at least partially within the housing and adding the first material to the housing, curing the first material, wherein the cured first material creates a transmissive optical cavity within the housing;
connecting first and second electrically conductive connectors to contact pads of the circuitry;
after curing the first material, filling at least a remaining space in the housing between the cured first material and an end of the housing with a second material; and
curing the second material.