US 12,120,943 B2
Display device and method of manufacturing the same
Wang Woo Lee, Osan-si (KR); Sung Ho Kim, Suwon-si (KR); Hyeon Sik Kim, Yongin-si (KR); Joon Hyoung Park, Seongnam-si (KR); Seok Je Seong, Seongnam-si (KR); Jin Sung An, Suwon-si (KR); Jin Seok Oh, Pyeongtaek-si (KR); Min Woo Woo, Seoul (KR); Ji Seon Lee, Seoul (KR); Pil Suk Lee, Hwaseong-si (KR); and Yun Sik Joo, Suwon-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Aug. 2, 2023, as Appl. No. 18/363,944.
Application 18/363,944 is a division of application No. 17/142,818, filed on Jan. 6, 2021, granted, now 11,758,798.
Claims priority of application No. 10-2020-0023624 (KR), filed on Feb. 26, 2020.
Prior Publication US 2023/0380256 A1, Nov. 23, 2023
Int. Cl. H10K 59/131 (2023.01); H10K 59/121 (2023.01); H10K 71/00 (2023.01); H10K 71/80 (2023.01); H10K 77/10 (2023.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01)
CPC H10K 77/111 (2023.02) [H10K 59/1213 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 71/80 (2023.02); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 27/124 (2013.01); H01L 27/1251 (2013.01); H01L 27/1266 (2013.01); H01L 27/127 (2013.01); H01L 27/1288 (2013.01); H01L 29/66757 (2013.01); H01L 29/66969 (2013.01); H01L 29/78675 (2013.01); H01L 29/7869 (2013.01); H10K 59/1201 (2023.02); H10K 2102/311 (2023.02)] 14 Claims
OG exemplary drawing
 
1. A method for manufacturing a display device, the method comprising:
forming a base substrate on a carrier substrate, the base substrate including:
an organic film including a polymeric material; and
an inorganic barrier film overlapping the organic film and extending outwardly from an edge of the organic film;
forming a first active pattern including a semiconductive material in a display area of the base substrate;
forming a first interlayer insulation layer on the first active pattern;
forming a second active pattern on the first interlayer insulation layer in the display area of the base substrate, the second active pattern including a semiconductive material different from the first active pattern;
forming a second interlayer insulation layer on the second active pattern;
forming a photoresist film on the second interlayer insulation layer;
exposing the photoresist film to light through a first mask including:
a first transmitting portion overlapping the first active pattern or the second active pattern; and
a second transmitting portion disposed between an edge of the carrier substrate and the edge of the organic film;
exposing an edge portion of the photoresist film to light, the edge portion of the photoresist film overlapping the edge of the carrier substrate;
developing the photoresist film to form a first photoresist pattern that includes a first opening and does not overlap the edge of the carrier substrate, the first opening overlapping the first active pattern or the second active pattern; and
forming a contact hole exposing the first active pattern or the second active pattern by using the first photoresist pattern as a mask.