US 12,120,938 B1
Methods of fabricating OLED panel with inorganic pixel encapsulating barrier
Ji Young Choung, Hwaseong-si (KR); Dieter Haas, Santa Clara, CA (US); Yu-hsin Lin, Zhubei (TW); Jungmin Lee, Santa Clara, CA (US); Seong Ho Yoo, San Ramon, CA (US); and Si Kyoung Kim, Gwangju-si (KR)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 20, 2023, as Appl. No. 18/390,720.
Application 18/390,720 is a continuation of application No. 18/545,676, filed on Dec. 19, 2023.
Application 18/545,676 is a continuation of application No. 18/346,059, filed on Jun. 30, 2023, granted, now 11,910,657, issued on Feb. 20, 2024.
Application 18/346,059 is a continuation of application No. 18/314,915, filed on May 10, 2023.
Application 18/314,915 is a continuation of application No. 18/049,868, filed on Oct. 26, 2022, granted, now 11,690,255, issued on Jun. 27, 2023.
Application 18/049,868 is a continuation of application No. 18/049,825, filed on Oct. 26, 2022, granted, now 11,690,254, issued on Jun. 27, 2023.
Application 18/049,825 is a continuation of application No. 17/498,482, filed on Oct. 11, 2021, granted, now 11,476,313, issued on Oct. 18, 2022.
Application 17/498,482 is a continuation of application No. 17/193,321, filed on Mar. 5, 2021, abandoned.
Application 17/498,482 is a continuation of application No. 17/193,347, filed on Mar. 5, 2021, granted, now 11,610,952, issued on Mar. 21, 2023.
Claims priority of provisional application 63/084,445, filed on Sep. 28, 2020.
Claims priority of provisional application 63/075,028, filed on Sep. 4, 2020.
Claims priority of provisional application 63/075,025, filed on Sep. 4, 2020.
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 59/80 (2023.01); H10K 59/122 (2023.01); H10K 59/173 (2023.01)
CPC H10K 59/873 (2023.02) [H10K 59/122 (2023.02); H10K 59/173 (2023.02)] 17 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate;
a plurality of overhang structures, the overhang structures having an upper portion having a bottom surface wider than a top surface of a lower portion, adjacent overhang structures defining wells of sub-pixels of the device; and
a plurality of sub-pixels, each sub-pixel comprising:
an anode;
an organic light-emitting diode (OLED) material disposed over the anode;
a cathode disposed over the OLED material;
first encapsulation layer disposed over the cathode and past an endpoint of the cathode, wherein the first encapsulation layer extends under at least a portion of the overhang structures along a sidewall of the lower portion and contacts the bottom surface of the upper portion of the overhang structures; and
a second encapsulation layer disposed over the first encapsulation layer, wherein the second encapsulation layer is disposed within a well of each sub-pixel and directly on the upper portion of the overhang structures.