| CPC H05K 7/20481 (2013.01) [C22C 9/00 (2013.01); C22C 21/00 (2013.01)] | 19 Claims |
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1. A composite material comprising a metal matrix and a structure in which thermally conductive particles are dispersed inside the metal matrix, wherein:
the metal matrix is composed of Cu, Ag, Al, Mg, or an alloy thereof;
the thermally conductive particles include diamond or SiC;
the thermally conductive particles are included at a volume ratio of 15% to 80%;
in a microstructure of the composite material, the distance between the center of any one thermally conductive particle and the center of a thermally conductive particle most adjacent to the any one thermally conductive particle is 200 μm or greater;
the any one thermally conductive particle and the thermally conductive particle most adjacent thereto are not in contact with each other but have a metal matrix therebetween; and
the thermal conductivity measured after heating the composite material to a temperature in Celsius lower by 20 to 30% than the melting point of the metal matrix has a thermal conductivity degradation rate of 5% or less based on the thermal conductivity thereof before the heating.
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