US 12,120,851 B2
3-D structured two-phase cooling boilers with nano structured boiling enhancement coating
Dennis Trieu, Calgary (CA); Ioannis Manousakis, Redmond, WA (US); Nicholas Andrew Keehn, Kirkland, WA (US); Husam Atallah Alissa, Redmond, WA (US); Bharath Ramakrishnan, Bellevue, WA (US); Kathryn M. Oseen-Senda, Seattle, WA (US); Douglas Patrick Kelley, Sammamish, WA (US); and Alexis Grace Schubert, Seattle, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Apr. 20, 2022, as Appl. No. 17/725,420.
Prior Publication US 2023/0345673 A1, Oct. 26, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20381 (2013.01) [H05K 7/203 (2013.01); H05K 7/20309 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal management device comprising:
A wicking heat spreader, wherein the wicking heat spreader includes plurality of continuous horizontal rails, the plurality of continuous horizontal rails having a rail width and a rail height, and wherein the plurality of continuous horizontal rails decrease in cross-sectional area towards a center of the wicking heat spreader; and
a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.