US 12,120,848 B2
Cooling module and electronic apparatus
Hao-Yu Wang, Yokohama (JP); Akinori Uchino, Yokohama (JP); Hajime Yoshizawa, Yokohama (JP); and Shusaku Tomizawa, Yokohama (JP)
Assigned to LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed by LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed on Oct. 6, 2022, as Appl. No. 17/938,371.
Claims priority of application No. 2021207889 (JP), filed on Dec. 22, 2021.
Prior Publication US 2023/0200014 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20336 (2013.01) [G06F 1/203 (2013.01); H05K 7/20172 (2013.01); H05K 7/20309 (2013.01); H05K 7/2039 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A cooling module comprising:
at least one fan having a fan housing with an intake port and an exhaust port;
a fin that faces the exhaust port of the at least one fan;
a heat pipe connected to a surface of the fin; and
a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin whereby the second surface is parallel with the heat pipe, and whereby the one edge is disposed between the heat pipe and the fin.