US 12,120,816 B2
Micro-roughened electrodeposited copper foil and copper clad laminate
Yun-Hsing Sung, Taoyuan (TW); Shih-Shen Lee, New Taipei (TW); Hung-Wei Hsu, Yun Lin County (TW); and Chun-Yu Kao, Yunlin County (TW)
Assigned to CO-TECH DEVELOPMENT CORP., Taipei (TW)
Filed by CO-TECH DEVELOPMENT CORP., Taipei (TW)
Filed on Jun. 23, 2021, as Appl. No. 17/355,515.
Application 17/355,515 is a division of application No. 16/899,630, filed on Jun. 12, 2020, abandoned.
Claims priority of provisional application 62/863,819, filed on Jun. 19, 2019.
Prior Publication US 2021/0321514 A1, Oct. 14, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/03 (2006.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01)
CPC H05K 1/0306 (2013.01) [B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); B32B 2250/02 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0338 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A micro-roughened electrodeposited copper foil comprising a micro-rough surface, wherein the micro-rough surface has an Rlr value of 1.05 to 1.60.