US 12,120,811 B2
Multi-dielectric printed circuit board
Arvind S, Bangalore (IN); Raghavendra Rao, Bangalore (IN); and Geejagaaru Krishnamurthy Sandesh, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2020, as Appl. No. 17/133,234.
Prior Publication US 2022/0201836 A1, Jun. 23, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/024 (2013.01) [H05K 1/0231 (2013.01); H05K 1/0243 (2013.01); H05K 3/4673 (2013.01); H05K 3/4688 (2013.01); H05K 1/0306 (2013.01); H05K 1/036 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0187 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB), comprising:
a first layer comprising a first dielectric material substantially exclusively; and
a second layer comprising the first dielectric material within a first region and a second dielectric material within a second region adjacent to the first region, wherein:
the first dielectric material has a first dielectric constant, a first coefficient of thermal expansion (CTE) and a first glass transition temperature (Tg);
the second dielectric material has a second dielectric constant, a second CTE and a second Tg;
the first dielectric constant is a greater than the second dielectric constant;
the first CTE is substantially equal to the second CTE; and
the first Tg and the second Tg are greater than 150° C.