US 12,119,808 B2
Transversely-excited film bulk acoustic resonator package
Patrick Turner, San Bruno, CA (US); Mike Eddy, Santa Barbara, CA (US); Andrew Kay, Irvine, CA (US); and Ventsislav Yantchev, Sofia (BG)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by MURATA MANUFACTURING CO., LTD, Kyoto (JP)
Filed on Oct. 28, 2020, as Appl. No. 17/082,945.
Application 16/998,300 is a division of application No. 16/841,134, filed on Apr. 6, 2020, granted, now 10,819,309, issued on Oct. 27, 2020.
Application 17/082,945 is a continuation in part of application No. 16/998,300, filed on Aug. 20, 2020.
Application 17/082,945 is a continuation in part of application No. 16/920,173, filed on Jul. 2, 2020, granted, now 11,139,794.
Application 16/920,173 is a continuation of application No. 16/438,121, filed on Jun. 11, 2019, granted, now 10,756,697, issued on Aug. 25, 2020.
Application 16/438,121 is a continuation in part of application No. 16/230,443, filed on Dec. 21, 2018, granted, now 10,491,192, issued on Nov. 26, 2019.
Claims priority of provisional application 62/904,416, filed on Sep. 23, 2019.
Claims priority of provisional application 62/881,749, filed on Aug. 1, 2019.
Claims priority of provisional application 62/830,258, filed on Apr. 5, 2019.
Claims priority of provisional application 62/753,815, filed on Oct. 31, 2018.
Claims priority of provisional application 62/748,883, filed on Oct. 22, 2018.
Claims priority of provisional application 62/741,702, filed on Oct. 5, 2018.
Claims priority of provisional application 62/701,363, filed on Jul. 20, 2018.
Claims priority of provisional application 62/685,825, filed on Jun. 15, 2018.
Prior Publication US 2021/0044275 A1, Feb. 11, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/25 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/58 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/25 (2013.01) [H03H 9/02228 (2013.01); H03H 9/02992 (2013.01); H03H 9/105 (2013.01); H03H 9/1085 (2013.01); H03H 9/586 (2013.01); H03H 9/6406 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic resonator device comprising:
an acoustic resonator chip comprising:
a substrate having a surface;
a piezoelectric layer attached to the surface of the substrate either directly or via one or more intermediate layers, the piezoelectric layer having portions that form at least two diaphragms over at least two cavities;
a first conductor pattern comprising one or more conductor layers at the piezoelectric layer, the first conductor pattern including:
at least two interdigital transducers (IDTs) each having interleaved fingers at the at least two diaphragms, and
a first plurality of contact pads;
an interposer comprising:
layers of a low temperature cofired ceramic (LTCC) circuit card, at least one layer of the LTCC circuit card comprising printed conductors;
interposer front and back surfaces; and
a second conductor pattern at the interposer back surface, the second conductor pattern including a second plurality of contact pads; and
a plurality of conductive balls directly connecting first ones of the contact pads of the first plurality of contact pads to respective contact pads of the second plurality of contact pads.