US 12,119,798 B2
Transversely-excited film bulk acoustic resonator package and method
Patrick Turner, Portola Valley, CA (US); Mike Eddy, Santa Barbara, CA (US); Andrew Kay, Provo, UT (US); Ventsislav Yantchev, Sofia (BG); and Charles Chung, San Francisco, CA (US)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jan. 12, 2023, as Appl. No. 18/153,741.
Application 18/153,741 is a continuation of application No. 17/497,888, filed on Oct. 9, 2021.
Application 17/497,888 is a continuation of application No. 17/067,418, filed on Oct. 9, 2020.
Application 17/067,418 is a continuation of application No. 16/841,134, filed on Apr. 6, 2020, granted, now 10,819,309, issued on Oct. 27, 2020.
Claims priority of provisional application 62/904,416, filed on Sep. 23, 2019.
Claims priority of provisional application 62/881,749, filed on Aug. 1, 2019.
Claims priority of provisional application 62/830,258, filed on Apr. 5, 2019.
Prior Publication US 2023/0170867 A1, Jun. 1, 2023
Int. Cl. H03H 9/25 (2006.01); H03H 3/02 (2006.01); H03H 3/04 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/58 (2006.01); H03H 9/64 (2006.01)
CPC H03H 3/02 (2013.01) [H03H 3/04 (2013.01); H03H 9/02228 (2013.01); H03H 9/02992 (2013.01); H03H 9/105 (2013.01); H03H 9/1085 (2013.01); H03H 9/25 (2013.01); H03H 9/586 (2013.01); H03H 9/6406 (2013.01); H03H 2003/023 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An acoustic resonator device comprising:
an acoustic resonator chip comprising:
a substrate;
a piezoelectric layer having first and second opposing surfaces and that is above a surface of the substrate, such that a portion of the piezoelectric layer forms a diaphragm spanning a cavity between the piezoelectric layer and the substrate; and
a first conductor pattern on at least one of the first and second surfaces of the piezoelectric layer, the first conductor pattern comprising an interdigitated transducer (IDT) having interleaved fingers on the diaphragm and a first contact pad; and
an interposer having a planar surface facing the piezoelectric layer and a second conductor pattern with a second contact pad on the planar surface of the interposer,
wherein at least a portion of the first conductor pattern is bonded to at least a portion of the second conductor pattern to form a seal that couples a perimeter of the piezoelectric layer of the acoustic resonator chip to a perimeter of the interposer.