CPC H01R 12/53 (2013.01) [H05K 1/144 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10393 (2013.01)] | 10 Claims |
1. A wiring device comprising:
a plate having a first surface and a second surface provided above the first surface;
a first protrusion provided on the second surface, the first protrusion having a side surface capable of locking a first substrate and a first upper surface including a plurality of first grooves provided parallel to a first direction, the first substrate being insertable in the first direction parallel to the second surface and being removable in a second direction opposite the first direction on the second surface and the first substrate including a terminal on a surface of the first substrate, each of the first grooves capable of accommodating a coating of a wiring including a conductor and the coating provided around the conductor, the first protrusion extending in a third direction intersecting the first direction and the second direction and the third direction being parallel to the second surface;
a holder provided on the second surface, the holder including a plurality of connection portions straddling the first substrate inserted, the holder being connected to the second surface to interpose the first substrate, and the holder including a second upper surface including a plurality of second grooves provided parallel to the first direction, each of the second grooves capable of accommodating the conductor exposed from the coating; and
a cover provided on the second surface, the cover including a support portion to support the cover so as to be rotatably openable and closable with respect to the plate, and the cover including a second protrusion capable of bringing the conductor into pressure contact with the terminal between the first protrusion and the holder, the conductor being exposed.
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