| CPC H01Q 9/0421 (2013.01) [H01Q 5/335 (2015.01)] | 24 Claims |
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1. A wireless device comprising:
a heatsink;
a dual-band wireless local area network (WLAN) radio to send or receive radio frequency (RF) signals in a first frequency range and a second frequency range;
a printed circuit board (PCB) comprising a ground plane and a dual-band inverted-F antenna (IFA) structure located at an opening in the ground plane, the opening being located at a side of the ground plane; and
one or more conductive spring clips coupled between the PCB and the heatsink, wherein the one or more conductive spring clips is to divert surface currents from the PCB, caused by the dual-band IFA structure, to the heatsink to minimize noise coupling from a circuit of the PCB to the dual-band IFA structure,
wherein the dual-band IFA structure comprises:
a feed point coupled to the WLAN radio, wherein the feed point is located at a first edge of the ground plane adjacent to the opening;
a first grounding point located at a second edge of the ground plane adjacent to the opening and opposite the first edge;
a second grounding point located at the first edge, the second grounding point being located farther away from the side than the feed point;
a feed arm coupled to the feed point;
a radiating arm coupled to the feed arm and the first grounding point;
a shorting arm coupled to the radiating arm and the second grounding point;
a first tuning component coupled to a distal end of the radiating arm and the first grounding point, wherein the first tuning component is configured to cause the dual-band IFA structure to radiate electromagnetic energy in the first frequency range; and
a second tuning component coupled to a distal end of the shorting arm and the second grounding point, wherein the second tuning component is configured to cause the dual-band IFA structure to radiate electromagnetic energy in the second frequency range.
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