US 12,119,532 B2
Waveguide arrangement
Timo Jaeschke, Hattingen (DE); and Simon Kueppers, Bochum (DE)
Assigned to 2pi-Labs GmbH, Bochum (DE)
Appl. No. 17/782,342
Filed by 2pi-Labs GmbH, Bochum (DE)
PCT Filed Dec. 18, 2020, PCT No. PCT/EP2020/086948
§ 371(c)(1), (2) Date Jun. 3, 2022,
PCT Pub. No. WO2021/123111, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 19218936 (EP), filed on Dec. 20, 2019; and application No. 20167973 (EP), filed on Apr. 3, 2020.
Prior Publication US 2023/0016951 A1, Jan. 19, 2023
Int. Cl. H01P 3/12 (2006.01); H01P 5/08 (2006.01); H01P 5/107 (2006.01); H01P 11/00 (2006.01); H01Q 1/22 (2006.01)
CPC H01P 3/121 (2013.01) [H01P 5/082 (2013.01); H01P 5/107 (2013.01); H01P 11/002 (2013.01); H01Q 1/2283 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for manufacturing a waveguide arrangement comprising a cavity surrounded by conductive material for guiding electromagnetic waves,
wherein at least part of the cavity is produced by removing from a printed circuit board material for manufacturing printed circuits, having at least one plate-shaped back and a conductive layer, in sections the conductive layer and parts of the back, whereby a surface structure in the form of a recess is formed, and wherein an electrically conductive wall is subsequently formed by depositing conductive material, which wall delimits the cavity.