US 12,119,422 B2
Systems and methods for encapsulating an electronic component
Peter Remmers, Hamburg (DE); Volker K. Kestler, Wrestedt (DE); and Thomas F. Kauffman, Woodbury, MN (US)
Assigned to H.B. Fuller Company, St. Paul, MN (US)
Appl. No. 17/593,073
Filed by H.B. Fuller Company, St. Paul, MN (US)
PCT Filed Mar. 6, 2020, PCT No. PCT/US2020/021531
§ 371(c)(1), (2) Date Sep. 8, 2021,
PCT Pub. No. WO2020/185615, PCT Pub. Date Sep. 17, 2020.
Claims priority of provisional application 62/815,799, filed on Mar. 8, 2019.
Prior Publication US 2022/0181511 A1, Jun. 9, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 31/048 (2014.01); H01L 31/18 (2006.01)
CPC H01L 31/18 (2013.01) [H01L 21/67126 (2013.01); H01L 31/0481 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of encapsulating an electronic component, the method comprising:
applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate,
the applicator roll comprising an outer surface and being spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component, the gap controlling the thickness of the first layer of encapsulating composition,
the first layer of encapsulating composition encapsulating the electronic component on the substrate, and
an interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.