US 12,119,326 B2
Microelectronic structures including bridges
Omkar G. Karhade, Chandler, AZ (US); and Bohan Shan, Tempe, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 18, 2020, as Appl. No. 17/126,505.
Prior Publication US 2022/0199575 A1, Jun. 23, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0655 (2013.01) [H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a substrate; and
a microelectronic component coupled to the substrate by a solder interconnect, wherein the solder interconnect includes a first portion and a second portion, the first portion is between the second portion and the substrate, the first portion has a height between 20 microns and 50 microns, and the first portion has a ground top surface.