CPC H01L 25/0655 (2013.01) [H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] | 20 Claims |
1. A microelectronic assembly, comprising:
a substrate; and
a microelectronic component coupled to the substrate by a solder interconnect, wherein the solder interconnect includes a first portion and a second portion, the first portion is between the second portion and the substrate, the first portion has a height between 20 microns and 50 microns, and the first portion has a ground top surface.
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