US 12,119,323 B2
Semiconductor device and method of manufacturing semiconductor device
Soichi Homma, Yokkaichi Mie (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Sep. 13, 2022, as Appl. No. 17/944,018.
Application 17/944,018 is a division of application No. 17/189,228, filed on Mar. 1, 2021, granted, now 11,476,230.
Claims priority of application No. 2020-123839 (JP), filed on Jul. 20, 2020.
Prior Publication US 2023/0005879 A1, Jan. 5, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/81 (2013.01) [H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06582 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, the method comprising:
forming a metal bump on a first surface side of a semiconductor chip;
positioning the semiconductor chip so the metal bump contacts a pad of an interconnection substrate;
applying a first light from a second surface side of the semiconductor chip and melting the metal bump with the first light;
allowing the melted metal bump to resolidify by stopping or reducing the application of the first light;
pressing the semiconductor chip toward the interconnection substrate after the stopping or reducing of the application of the first light;
applying a second light from the second surface side of the semiconductor chip while pressing the semiconductor chip toward the interconnection substrate to melt the metal bump; and
allowing the melted metal bump to resolidify by stopping or reducing the application of the second light, wherein
the application of the second light is started after the pressing of the semiconductor chip toward the interconnection substrate begins, and
the pressing of the semiconductor chip toward the interconnection substrate is stopped after the stopping or reducing of the application of the second light.