CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0348 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/03916 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05576 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/35121 (2013.01)] | 18 Claims |
1. An electronic device substrate comprising:
a repassivation material layer having a substantially planar surface formed on the substrate from a first electrically nonconductive material; and
a metalized pad surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad;
wherein the metalized pad has a solderable surface and electrically contacts an electrical contact pad on the substrate beneath the metalized pad; and
wherein the metalized pad includes metalized fingers that extend radially from the outer boundary of the metalized pad in interdigitated arrangement with the repassivation material layer.
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