US 12,119,316 B2
Patterned and planarized under-bump metallization
Namrata Kanth, Mesa, AZ (US); Paul Southworth, Groesbeek (NL); Scott M. Hayes, Chandler, AZ (US); Dwight Lee Daniels, Phoenix, AZ (US); Yufu Liu, Taoyuan (TW); Jeroen Johannes Maria Zaal, Nijmegen (NL); and Cheong Chiang Ng, Cheras (MY)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, Inc., Austin, TX (US)
Filed on May 19, 2022, as Appl. No. 17/664,113.
Prior Publication US 2023/0378106 A1, Nov. 23, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0348 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/03916 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05576 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/35121 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device substrate comprising:
a repassivation material layer having a substantially planar surface formed on the substrate from a first electrically nonconductive material; and
a metalized pad surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad;
wherein the metalized pad has a solderable surface and electrically contacts an electrical contact pad on the substrate beneath the metalized pad; and
wherein the metalized pad includes metalized fingers that extend radially from the outer boundary of the metalized pad in interdigitated arrangement with the repassivation material layer.