US 12,119,312 B2
Device package
Cheng-Nan Lin, Kaohsiung (TW); Wei-Tung Chang, Kaohsiung (TW); Jen-Chieh Kao, Kaohsiung (TW); and Huei-Shyong Cho, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jul. 18, 2023, as Appl. No. 18/223,525.
Application 18/223,525 is a continuation of application No. 17/347,220, filed on Jun. 14, 2021, granted, now 11,705,412.
Application 17/347,220 is a continuation of application No. 16/453,780, filed on Jun. 26, 2019, granted, now 11,037,891, issued on Jun. 15, 2021.
Claims priority of provisional application 62/735,000, filed on Sep. 21, 2018.
Prior Publication US 2023/0361060 A1, Nov. 9, 2023
Int. Cl. H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1421 (2013.01); H01Q 1/243 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a circuit structure;
an antenna structure disposed over the circuit structure;
a conductive element configured to transmit a radio frequency (RF) signal between the circuit structure and the antenna structure; and
an encapsulant encapsulating the conductive element and including an indented portion having a first lateral side surface spaced apart from the conductive element,
wherein the encapsulant has a first upper surface connected to the antenna structure and a second upper surface, and the first lateral side surface of the indented portion extends between the first upper surface and the second upper surface of the encapsulant,
wherein the encapsulant further has a second lateral side surface spaced apart from the first lateral side surface and contacting the conductive element, and
wherein a length of the second lateral side surface is greater than a length of the first lateral side surface in a cross-sectional view perspective.