US 12,119,293 B2
Through electrode substrate and mounting substrate
Shinji Maekawa, Tokyo-to (JP); Hiroshi Kudo, Tokyo-to (JP); Takamasa Takano, Tokyo-to (JP); Hiroshi Mawatari, Tokyo-to (JP); and Masaaki Asano, Tokyo-to (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
Filed on Oct. 8, 2021, as Appl. No. 17/497,261.
Application 17/497,261 is a division of application No. 16/322,741, abandoned, previously published as PCT/JP2017/028429, filed on Aug. 4, 2017.
Claims priority of application No. 2016-153977 (JP), filed on Aug. 4, 2016.
Prior Publication US 2022/0028772 A1, Jan. 27, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/15 (2006.01); H05K 3/46 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49838 (2013.01); H05K 3/46 (2013.01); H01L 23/49894 (2013.01); H01L 2221/68345 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A through electrode substrate comprising:
a first side of the through electrode substrate;
a second side of the through electrode substrate opposite the first side;
a substrate including a first surface facing the first side, and a second surface facing the second side, the substrate being provided with a through hole;
a through electrode positioned in the through hole of the substrate, the through electrode having a first end surface facing the first side and a second end surface facing the second side; and
a first wiring structure including at least a first wiring layer positioned on the first surface of the substrate, and a second wiring layer positioned on the first wiring layer, wherein
the first wiring layer has a first insulation layer provided with a first opening positioned on the first end surface of the through electrode, and a first electroconductive layer connected to the first end surface of the through electrode through the first opening of the first insulation layer,
the second wiring layer has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer,
the first electroconductive layer of the first wiring layer is connected to the first end surface at a position overlapped with the through hole of the substrate when seen along the normal direction of the first surface of the substrate,
the first insulation layer of the first wiring layer includes at least an organic layer, which is in contact with the first end surface of the through electrode,
the second insulation layer of the second wiring layer includes an inorganic layer having insulation properties, and
the inorganic layer of the second insulation layer of the second wiring layer is positioned toward the first side relative to the organic layer of the first insulation layer of the first wiring layer.