US 12,119,290 B2
Semiconductor device
Takumi Kanda, Kyoto (JP); Masaaki Matsuo, Kyoto (JP); Soichiro Takahashi, Kyoto (JP); Yoshitoki Inami, Kyoto (JP); and Kaito Inoue, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Apr. 26, 2023, as Appl. No. 18/307,775.
Application 18/307,775 is a continuation of application No. 17/455,619, filed on Nov. 18, 2021, granted, now 11,670,572.
Application 17/455,619 is a continuation of application No. 16/642,721, granted, now 11,211,312, previously published as PCT/JP2018/042684, filed on Nov. 19, 2018.
Claims priority of application No. 2017-222602 (JP), filed on Nov. 20, 2017; and application No. 2017-223349 (JP), filed on Nov. 21, 2017.
Prior Publication US 2024/0079296 A1, Mar. 7, 2024
Int. Cl. H01L 23/495 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 23/49524 (2013.01); H01L 23/49579 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first conductive plate including a first main surface perpendicular to a thickness direction of the first conductive plate;
a second conductive plate including a second main surface perpendicular to the thickness direction, the second conductive plate being spaced apart from the first conductive plate in a first direction perpendicular to the thickness direction;
a plurality of first switching elements electrically bonded to the first conductive plate and electrically connected to the second conductive plate;
a plurality of second switching elements electrically bonded to the second conductive plate;
a first supply terminal electrically bonded to the first conductive plate;
a second supply terminal having a region that overlaps with the first supply terminal as viewed in the thickness direction, the second supply terminal being spaced apart from the first conductive plate and the first supply terminal in the thickness direction;
a terminal insulating member being plate-shaped and interposed between the first supply terminal and the second supply terminal in the thickness direction, wherein
the second supply terminal is electrically connected to the plurality of second switching elements,
the terminal insulating member is greater in size than each of the first supply terminal and the second supply terminal in a second direction perpendicular to the thickness direction and the first direction; and
an insulating layer including a main surface perpendicular to the thickness direction, wherein
the first conductive plate and the second conductive plate are bonded to the main surface of the insulating layer,
the first conductive plate and the second conductive plate have a thickness that is larger than a thickness of the insulating layer, and
the first conductive plate and the second conductive plate each have a first layer and a second layer, the first layer being bonded to the main surface of the insulating layer, and the second layer being located on a side of the first layer opposite to the insulating layer in the thickness direction, and the second layer has a thickness that is larger than a thickness of the first layer.