US 12,119,288 B2
Semiconductor package
Youngbae Kim, Seoul (KR); and Sungwoo Park, Anyang-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 8, 2022, as Appl. No. 17/658,614.
Claims priority of application No. 10-2021-0084512 (KR), filed on Jun. 29, 2021.
Prior Publication US 2022/0415758 A1, Dec. 29, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/4951 (2013.01) [H01L 23/49548 (2013.01); H01L 24/16 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 24/14 (2013.01); H01L 2224/1415 (2013.01); H01L 2224/16258 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a lead frame that includes a first surface and a second surface opposite to the first surface, wherein the lead frame further includes a first lead that extends in a first direction, and a plurality of second leads that are spaced apart from the first lead on both sides of the first lead;
at least one semiconductor chip mounted on the first surface of the lead frame by a plurality of bumps; and
an encapsulant that encapsulates the lead frame and the at least one semiconductor chip,
wherein the first lead has a groove in the first surface that partitions the plurality of bumps in contact with the first lead, wherein the groove comprises,
a first groove disposed in the first lead and that extends in the first direction; and
a plurality of second grooves that extend from the first groove in a second direction that is perpendicular to the first direction,
wherein the first groove and each of the second grooves is spaced apart from an outer side surface of the first lead,
wherein first groove partitions the plurality of bumps in the first direction, and the second grooves partition the plurality of bumps in the second direction.