US 12,119,279 B2
Semiconductor device having at least one resin part that closes one or more corresponding ones of a plurality of threaded holes
Mamoru Togami, Tokyo (JP); Toshitaka Sekine, Tokyo (JP); Teruaki Nagahara, Tokyo (JP); Hiroyuki Nakamura, Tokyo (JP); Kazuhiro Kawahara, Tokyo (JP); Kosuke Yamaguchi, Tokyo (JP); and Shota O, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Sep. 10, 2021, as Appl. No. 17/471,688.
Claims priority of application No. 2020-188457 (JP), filed on Nov. 12, 2020.
Prior Publication US 2022/0148937 A1, May 12, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 23/40 (2006.01); F16B 37/14 (2006.01); F16B 41/00 (2006.01); H01L 23/32 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 23/4006 (2013.01); F16B 37/14 (2013.01); F16B 41/005 (2013.01); H01L 23/32 (2013.01); H01L 23/49555 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor device to be mounted to a substrate, the semiconductor device comprising:
a package to seal a semiconductor element;
a lead frame having one end portion connected to the semiconductor element and an other end portion protruding from a side surface of the package;
a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and
at least one resin part that closes one or more corresponding ones of the threaded holes, at least one of the threaded holes being in an open state, the closed one or more corresponding ones of the threaded holes being visible from outside the package, where a lowest surface of the at least one resin part is offset from a lowest surface of the package.