US 12,119,248 B2
Module tray for semiconductor device
Taegeon Kim, Suwon-si (KR)
Assigned to Samsung Electronics Co , Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 14, 2023, as Appl. No. 18/183,520.
Claims priority of application No. 10-2022-0099787 (KR), filed on Aug. 10, 2022.
Prior Publication US 2024/0055286 A1, Feb. 15, 2024
Int. Cl. H01L 21/673 (2006.01)
CPC H01L 21/67333 (2013.01) 20 Claims
OG exemplary drawing
 
1. A module tray for a semiconductor device, comprising:
a case having a base plate, first and second sidewalls extending from opposite sides of the base plate in a vertical direction to define an accommodation space, and first and second fastening grooves respectively formed in inner surfaces of the first and second sidewalls and extending in the vertical direction, the first and second fastening grooves having upper ends opened to upper surfaces of the first and second sidewalls respectively; and
an insert block having a substrate accommodating space for accommodating a semiconductor substrate, the insert block detachably inserted into the first and second fastening grooves of the case, the insert block having first and second fastening joints extending in the vertical direction such that the first and second fastening joint are respectively inserted through the upper ends of the first and second fastening grooves.