US 12,119,241 B2
Unit for supplying substrate treating liquid and apparatus for treating substrate including the same
Dong Hwa Lee, Chungcheongnam-do (KR); Dai Geon Yoon, Chungcheongnam-do (KR); Soo Hong Lee, Gyeonggi-do (KR); Ji Hyeon Kim, Chungcheongnam-do (KR); and Dae Sung Kim, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Aug. 2, 2022, as Appl. No. 17/879,012.
Claims priority of application No. 10-2021-0111469 (KR), filed on Aug. 24, 2021.
Prior Publication US 2023/0068426 A1, Mar. 2, 2023
Int. Cl. B41J 2/165 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67051 (2013.01) [B41J 2/16517 (2013.01); H01L 21/67253 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A unit for supplying a substrate-treating liquid, the unit comprising:
a supply reservoir module comprising:
a first reservoir configured to supply the substrate-treating liquid to an inkjet head unit configured to jet the substrate-treating liquid onto a substrate, and
a second reservoir configured to recover the substrate-treating liquid that remains unused in the inkjet head unit;
a buffer reservoir module configured to provide the substrate-treating liquid to the first reservoir;
a first line directly connecting the first reservoir and the second reservoir; and
a circulation control module configured to circulate and re-supply the substrate-treating liquid from the second reservoir to the first reservoir,
wherein a differential pressure is constantly maintained between the first reservoir and the second reservoir.