US 12,119,239 B2
Packaged semiconductor devices, and package molds for forming packaged semiconductor devices
Soon Lee Liew, Perak (MY); Eng Wah Woo, Perak (MY); Alexander Komposch, Morgan Hill, CA (US); Kok Meng Kam, Perak (MY); and Samantha Cheang, Perak (MY)
Assigned to Wolfspeed, Inc., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on Nov. 22, 2021, as Appl. No. 17/532,027.
Prior Publication US 2023/0162991 A1, May 25, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/565 (2013.01) [H01L 23/3114 (2013.01); H01L 23/49541 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A package mold, comprising:
a first mold body and a second mold body;
a mold cavity defined in between the first mold body and the second mold body by the first mold body and the second mold body being brought into contact;
a gate in a first side of the mold cavity for supplying liquid mold compound into the mold cavity;
a longitudinal vent for releasing gas from the mold cavity in a second side of the mold cavity opposite the first side of the mold cavity; and
a transverse vent for releasing gas from the mold cavity in a third side of the mold cavity that extends from the first side of the mold cavity to the second side of the mold cavity and between the first and second sides of the mold cavity.