CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 41/00 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H01F 2027/2809 (2013.01); H01G 4/30 (2013.01)] | 20 Claims |
1. A method for manufacturing a passive electronic component, the passive electronic component including an insulator portion, a conductor portion provided in the insulator portion, a terminal electrode electrically connected to the conductor portion and disposed on at least one of surfaces of the insulator portion, and at least one marker portion provided in at least one recessed portion of at least one of the surfaces of the insulator portion, the method comprising the steps of:
stacking together a plurality of lamination sheets each containing a resin;
disposing at least one marker portion on an uppermost lamination sheet and among the plurality of lamination sheets;
press-bonding the plurality of lamination sheets stacked together, to obtain a laminate; and
dicing the laminate into parts of a desired size and heating the parts,
wherein the step to obtain the laminate includes pressing in the at least one marker portion disposed on the lamination sheets in a lamination direction of the plurality of lamination sheets, such that an upper surface of the at least one marker portion becomes concave from an upper surface of the uppermost lamination sheet.
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