US 12,119,154 B2
Coil device
Kiyofumi Fujiwara, Tokyo (JP); Hiroyuki Iwata, Tokyo (JP); Eietsu Abe, Tokyo (JP); Sepung Ki, Gyeonggi-Do (KR); and Chihu An, Gyeonggi-Do (KR)
Assigned to TDK CORPORATION, Tokyo (JP); and TDK KOREA CORPORATION, Pyeongtaek-Si (KR)
Filed by TDK CORPORATION, Tokyo (JP); and TDK KOREA CORPORATION, Pyeongtaek-Si (KR)
Filed on Mar. 23, 2021, as Appl. No. 17/209,761.
Claims priority of application No. 2020-052784 (JP), filed on Mar. 24, 2020.
Prior Publication US 2021/0304943 A1, Sep. 30, 2021
Int. Cl. H01F 27/28 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01)
CPC H01F 17/045 (2013.01) [H01F 27/2823 (2013.01); H01F 27/292 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A coil device comprising
a core including a winding core, and
a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein
the winding wire part includes
a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer,
a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other, and
a third part in which the first wire and the second wire of a same turn are would in a same layer without being adjacent to each other, and
an inner most layer of the winding wire part contacting the winding core consists of the first part.