US 12,119,066 B2
Flash memory device having multi-stack structure and channel separation method thereof
Hyebin Kim, Suwon-si (KR); Yohan Lee, Suwon-si (KR); and Ho-Jun Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 7, 2022, as Appl. No. 17/982,081.
Claims priority of application No. 10-2021-0154258 (KR), filed on Nov. 10, 2021; and application No. 10-2022-0064448 (KR), filed on May 26, 2022.
Prior Publication US 2023/0145117 A1, May 11, 2023
Int. Cl. G11C 16/10 (2006.01); G11C 16/08 (2006.01); G11C 16/12 (2006.01)
CPC G11C 16/102 (2013.01) [G11C 16/08 (2013.01); G11C 16/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flash memory device comprising:
a first memory cell;
a second memory cell on the first memory cell; and
a third memory cell between the first memory cell and the second memory cell,
wherein the first memory cell, the second memory cell and the third memory cell share a channel,
wherein the third memory cell is configured to block channel sharing between the first memory cell and the second memory cell based on a channel separation voltage provided in first to k-th program loops, and
wherein the third memory cell is configured to connect the channel sharing between the first memory cell and the second memory cell based on a channel connection voltage provided to the third memory cell in a (k+1)-th program loop.