US 12,118,726 B2
Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods
Peter Julius Klaerner, Corona, CA (US)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed on Jan. 14, 2022, as Appl. No. 17/575,705.
Claims priority of provisional application 63/138,377, filed on Jan. 15, 2021.
Prior Publication US 2022/0230314 A1, Jul. 21, 2022
Int. Cl. G06T 7/00 (2017.01); G06V 10/141 (2022.01); G06V 10/74 (2022.01); G06V 20/60 (2022.01)
CPC G06T 7/0014 (2013.01) [G06V 10/141 (2022.01); G06V 10/74 (2022.01); G06V 20/60 (2022.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01)] 18 Claims
OG exemplary drawing
 
15. A wire bonding system comprising:
a support structure for supporting a workpiece during a wire bonding operation;
a bond head assembly carrying a wire bonding tool; and
a pattern recognition system including
(i) an imaging system for imaging a portion of the workpiece using an image acquisition recipe, the portion of the workpiece including a fiducial marking of the workpiece, the image acquisition recipe including a plurality of parameters related to the imaging system of the pattern recognition system, the plurality of parameters including at least one of (a) one or more lighting parameters of the imaging system, (b) one or more optical parameters of the imaging system, (c) one or more position parameters of the imagining system, and (d) one or more component parameters related to the imaging system,
(ii) a control system for controlling the imaging system, and
(iii) a computer configured to utilize a pattern recognition recipe in connection with an image from the imaging system to determine if an acceptable level of matching occurs in connection with the fiducial marking on the workpiece to determine if the wire bonding operation may proceed, wherein the acceptable level of matching is determined by comparing a pattern from an acquired image taken by the imaging system with a reference pattern, the computer varying at least one parameter of the image acquisition recipe if the acceptable level of matching does not occur, the varying of the at least one parameter by the computer resulting in a new image acquisition recipe, the computer further configured to repeat imaging of the portion of the workpiece using the new image acquisition recipes until an acceptable level of matching occurs, the computer further configured to save the new image acquisition recipe that results in the acceptable level of matching into memory.