US 12,117,691 B2
Method of producing light-emitting device and planar light source
Takuya Nakabayashi, Tokushima (JP); Ryohei Yamashita, Tokushima (JP); Keiji Emura, Anan (JP); Tsuyoshi Okahisa, Tokushima (JP); and Toshinobu Katsumata, Fujiyoshida (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Oct. 17, 2022, as Appl. No. 18/047,041.
Application 18/047,041 is a continuation of application No. 17/446,388, filed on Aug. 30, 2021, granted, now 11,506,934.
Claims priority of application No. 2020-146125 (JP), filed on Aug. 31, 2020.
Prior Publication US 2023/0085463 A1, Mar. 16, 2023
Int. Cl. G02F 1/13357 (2006.01); G02F 1/1335 (2006.01); H01L 25/075 (2006.01)
CPC G02F 1/133605 (2013.01) [G02F 1/133606 (2013.01); G02F 1/133612 (2021.01); H01L 25/0753 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of producing a light-emitting device, comprising:
mounting a plurality of light-emitting elements onto a wiring board comprising an interconnect layer such that the light-emitting elements are electrically coupled to the interconnect layer;
forming a light-reflecting member on the wiring board, the light-reflecting member covering at least a portion of lateral surfaces of each light-emitting element;
disposing, onto respective upper surfaces of the light-emitting elements, multilayer structures each comprising a light-transmitting layer and a light-reflecting layer on the light-transmitting layer;
providing a low-refractive-index layer; and
disposing a light-diffusing layer over the low-refractive-index layer, the low-refractive-index layer having a refractive index lower than that of the light-transmitting layers.