US 12,117,392 B2
Gas sensor
Toshiaki Fukunaka, Tokyo (JP); and Hiroyuki Kato, Tokyo (JP)
Assigned to Asahi Kasei Microdevices Corporation, Tokyo (JP)
Filed by ASAHI KASEI MICRODEVICES CORPORATION, Tokyo (JP)
Filed on Aug. 4, 2023, as Appl. No. 18/230,441.
Application 18/230,441 is a continuation of application No. 17/485,585, filed on Sep. 27, 2021, granted, now 11,747,273.
Claims priority of application No. 2020-162656 (JP), filed on Sep. 28, 2020; and application No. 2021-136579 (JP), filed on Aug. 24, 2021.
Prior Publication US 2023/0375470 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01N 21/3504 (2014.01); G01N 15/06 (2006.01); G01N 15/075 (2024.01); G01N 21/27 (2006.01)
CPC G01N 21/3504 (2013.01) [G01N 15/06 (2013.01); G01N 15/075 (2024.01); G01N 21/27 (2013.01); G01N 2201/12 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A gas sensor, comprising:
a light receiving element;
a light emitting element;
an integrated circuit;
a conductive lead frame; and
a sealing member configured to seal the light receiving element, the light emitting element, the integrated circuit, and the lead frame into a package,
wherein the lead frame includes at least one die pad portion and a plurality of terminal portions, wherein at least the die pad portion includes a first region having a first thickness and a second region having a second thickness thinner than the first thickness, and
wherein the integrated circuit is arranged on the second region of the die pad portion and is electrically connected to at least one of the plurality of terminal portions.