US 12,117,349 B2
Sensor system, sensor array and process of using the sensor system
Andreas Barbul, Munich (DE); and Matthias König, Munich (DE)
Assigned to TDK Corporation, Tokyo (JP)
Filed by TDK Corporation, Tokyo (JP)
Filed on Mar. 29, 2022, as Appl. No. 17/706,918.
Claims priority of application No. 102021108090.8 (DE), filed on Mar. 30, 2021.
Prior Publication US 2022/0316958 A1, Oct. 6, 2022
Int. Cl. G01K 1/16 (2006.01)
CPC G01K 1/16 (2013.01) 20 Claims
OG exemplary drawing
 
1. A sensor system comprising:
a first sensor having a first thermistor configured to sense a change in heat flow and a first heater configured to heat the first thermistor; and
a second sensor having a second thermistor configured to sense a change in heat flow and a second heater configured to heat the second thermistor,
wherein a heat conduction path between the first heater and the first thermistor has a higher thermal conductivity than a heat conduction path between the second heater and the second thermistor, and
wherein the heat conduction path in the first sensor is a path along which the heat is conductable between the first heater and the first thermistor, and the heat conduction path in the second sensor is a path along which the heat is conductable between the second heater and the second thermistor.