CPC F16K 7/17 (2013.01) [H01L 21/67017 (2013.01)] | 11 Claims |
1. A valve for a semiconductor manufacturing device, comprising:
a valve main body; and
a valve seat and a diaphragm provided in the valve main body, wherein the valve is configured to open or close in accordance with contact or non-contact between the diaphragm and the valve seat,
wherein the valve main body is provided with an opening/closing mechanism which pressurizes the diaphragm to cause valve closing,
wherein a load distributing member is provided inside the opening/closing mechanism, the load distributing member being arranged in parallel with the valve seat,
wherein the load distributing member is arranged between a first planar surface of a portion provided contiguously to the opening/closing mechanism and a second planar surface that is opposite the first planar surface, the load distributing member being arranged on the second planar surface, such that when the valve is in an open state, a predetermined gap exists between the load distributing member and the first planar surface of the portion provided contiguously to the opening/closing mechanism, and such that when the valve is in a closed state, the first planar surface of the portion provided contiguously to the opening/closing mechanism directly contacts the load distributing member,
wherein the load distributing member is arranged so as to be capable of expansion and contraction throughout its entire thickness in a loading direction, and such that an entirety of the load distributing member is capable of free expansion in a lateral direction in response to compression of the load distributing member in the loading direction, and
wherein the valve main body has a duplexed structure in which, while a thrust produced by the opening/closing mechanism is maintained, a fastening load required at valve closing is received as being distributed to the valve seat and the load distributing member.
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