US 12,116,671 B2
Laminate and method for producing same
Akira Furuya, Tokyo (JP); Tadaaki Kojima, Tokyo (JP); and Hiroshi Suzuki, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Appl. No. 17/614,222
Filed by SHOWA DENKO K.K., Tokyo (JP)
PCT Filed Sep. 11, 2020, PCT No. PCT/JP2020/034516
§ 371(c)(1), (2) Date Nov. 24, 2021,
PCT Pub. No. WO2021/070561, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 2019-186772 (JP), filed on Oct. 10, 2019.
Prior Publication US 2022/0228266 A1, Jul. 21, 2022
Int. Cl. C23C 18/16 (2006.01); B32B 15/01 (2006.01); C23C 18/44 (2006.01); C23C 18/50 (2006.01); C23C 28/02 (2006.01); C25D 3/12 (2006.01); H01L 21/687 (2006.01)
CPC C23C 18/1651 (2013.01) [B32B 15/015 (2013.01); C23C 18/1637 (2013.01); C23C 18/1653 (2013.01); C23C 18/1689 (2013.01); C23C 18/44 (2013.01); C23C 18/50 (2013.01); C23C 28/021 (2013.01); C25D 3/12 (2013.01); H01L 21/68757 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A laminate comprising a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer,
wherein pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater, and
wherein the nickel-containing plating film layer comprises a nickel-phosphorus alloy plating layer (1) having a phosphorus concentration of 8% by mass or higher and lower than 10% by mass, and a nickel-phosphorus alloy plating layer (2) having a phosphorus concentration of 10% by mass or higher and 12% by mass or lower in this order from the metallic base material.