US 12,116,666 B2
Substrate processing apparatus and method of manufacturing semiconductor device
Daigi Kamimura, Toyama (JP); Takeshi Ito, Toyama (JP); and Tomoshi Taniyama, Toyama (JP)
Assigned to KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed by HITACHI KOKUSAI ELECTRIC INC., Tokyo (JP)
Filed on Jan. 25, 2018, as Appl. No. 15/880,245.
Application 15/880,245 is a continuation of application No. PCT/JP2016/069123, filed on Jun. 28, 2016.
Claims priority of application No. 2015-154392 (JP), filed on Aug. 4, 2015.
Prior Publication US 2018/0148834 A1, May 31, 2018
Int. Cl. C23C 16/44 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/54 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/02 (2006.01)
CPC C23C 16/4408 (2013.01) [C23C 16/345 (2013.01); C23C 16/45546 (2013.01); C23C 16/45578 (2013.01); C23C 16/45589 (2013.01); C23C 16/45591 (2013.01); C23C 16/4584 (2013.01); C23C 16/54 (2013.01); H01L 21/67017 (2013.01); H01L 21/67196 (2013.01); H01L 21/67313 (2013.01); H01L 21/67766 (2013.01); H01L 21/67775 (2013.01); H01L 21/0217 (2013.01); H01L 21/02211 (2013.01); H01L 21/0228 (2013.01); H01L 21/67772 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a transfer chamber wherein a substrate from a container is transported;
a transfer robot configured to transfer the substrate through the transfer chamber;
a purge gas supply mechanism configured to supply a purge gas into the transfer chamber; and
a pressure control mechanism installed at an exhaust channel wherethrough an inner atmosphere of the transfer chamber is exhausted to control an inner pressure of the transfer chamber and comprising:
a lower portion directly connected to the exhaust channel;
an exhaust damper comprising a cover member, wherein the cover member is provided over the lower portion and has a shape of a box comprising an open side and a bottom opening provided at a bottom of the cover member to face the exhaust channel at the lower portion; and
an adjusting damper comprising a back pressure valve provided in the cover member, wherein the back pressure valve is configured to open and close the bottom opening of the cover member depending on the inner pressure of the transfer chamber,
wherein the cover member is configured such that the bottom opening of the cover member is fluidically coupled to the open side of the cover member if the bottom opening is opened by the back pressure valve, and that the bottom opening of the cover member is fluidically decoupled from the open side of the cover member if the bottom opening is closed by the back pressure valve in a state where the cover member is pressed against the lower portion of the pressure control mechanism.