US 12,116,512 B2
Transfer foil for touch sensor and method for manufacturing conductive film for touch sensor
Naoharu Kiyoto, Kanagawa (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Sep. 13, 2021, as Appl. No. 17/473,516.
Application 17/473,516 is a continuation of application No. PCT/JP2020/009054, filed on Mar. 4, 2020.
Claims priority of application No. 2019-068299 (JP), filed on Mar. 29, 2019; and application No. 2019-136819 (JP), filed on Jul. 25, 2019.
Prior Publication US 2021/0403769 A1, Dec. 30, 2021
Int. Cl. C09J 9/02 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 37/00 (2006.01); C09J 5/00 (2006.01); C09J 7/25 (2018.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); G06F 3/041 (2006.01)
CPC C09J 9/02 (2013.01) [B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 37/025 (2013.01); C09J 5/00 (2013.01); C09J 7/25 (2018.01); C09J 7/38 (2018.01); C09J 7/405 (2018.01); G06F 3/041 (2013.01); B32B 2307/202 (2013.01); B32B 2457/208 (2013.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2400/163 (2013.01); C09J 2479/086 (2013.01); G06F 2203/04103 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A transfer foil for a touch sensor for transferring a conductive layer to a support, the transfer foil comprising:
a temporary support;
the conductive layer disposed on a surface of the temporary support; and
a layer to be bonded to a support that is disposed on a surface of the conductive layer and consists of a pressure-sensitive adhesive layer or a curable adhesive layer,
wherein a peel adhesion between the temporary support and the conductive layer is 0.20 N/mm or less,
the layer to be bonded to a support has a thickness of 20 μm or less and a modulus of elasticity of 0.10 MPa or more at a temperature of 130° C.,
the conductive layer includes a detection electrode that has a mesh pattern formed of a thin wire consisting of a conductive member, a lead wire that consists of the conductive member and is drawn from the detection electrode, and an external connection terminal that is connected to the lead wire, and
the thin wire forming the mesh pattern of the detection electrode has a line width of 1.0 μm or more and 4.5 μm or less.