	US 12,116,510 B2
	Hot melt adhesive composition, adhesive tape, and method for producing adhesive tape
Yoshiaki Yamamoto, Tokyo (JP); Akiyoshi Kimura, Tokyo (JP); Yosuke Tate, Tokyo (JP); and Toshikatsu Mitsunaga, Tokyo (JP)
Assigned to DENKA COMPANY LIMITED, Tokyo (JP)
Appl. No. 17/637,268
Filed by DENKA COMPANY LIMITED, Tokyo (JP)
PCT Filed Sep. 24, 2020, PCT No. PCT/JP2020/035980 § 371(c)(1), (2) Date Feb. 22, 2022, PCT Pub. No. WO2021/065662, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 2019-181606 (JP), filed on Oct. 1, 2019.
Prior Publication US 2022/0306904 A1, Sep. 29, 2022
Int. Cl. C09J 125/10 (2006.01); C09J 5/06 (2006.01); C09J 7/35 (2018.01); C09J 11/06 (2006.01); C09J 11/08 (2006.01)

CPC C09J 7/35 (2018.01) [C09J 5/06 (2013.01); C09J 11/08 (2013.01); C09J 125/10 (2013.01); C09J 2301/16 (2020.08); C09J 2301/304 (2020.08); C09J 2301/408 (2020.08)]

6 Claims

1. A hot melt adhesive composition, comprising:

a styrene-based block copolymer;

a tackifier; and

a plasticizer; wherein:

the styrene-based block copolymer is a styrene-butadiene block copolymer and a butadiene portion thereof is hydrogenated by 20 mass % to 90 mass %;

the tackifier is contained by 65 to 190 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer; and

the plasticizer is contained by 0.1 to 24 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer.