	US 12,116,451 B2
	Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
Hideyuki Katagi, Tokyo (JP); Yuki Nakamura, Tokyo (JP); Kazumasa Fukuda, Tokyo (JP); Tomohiro Ikeda, Tokyo (JP); Lin Tian, Tokyo (JP); Kei Tougasaki, Tokyo (JP); Naoki Maruyama, Tokyo (JP); and Yoshitaka Takezawa, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/598,305
Filed by SHOWA DENKO MATERIALS CO., LTD., Tokyo (JP)
PCT Filed Mar. 27, 2019, PCT No. PCT/JP2019/013363 § 371(c)(1), (2) Date Sep. 27, 2021, PCT Pub. No. WO2020/194601, PCT Pub. Date Oct. 1, 2020.
Prior Publication US 2022/0162374 A1, May 26, 2022
Int. Cl. C08G 59/14 (2006.01); C08G 59/16 (2006.01); C08G 59/24 (2006.01); C08G 59/28 (2006.01); C08G 59/30 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01)

CPC C08G 59/1455 (2013.01) [C08G 59/245 (2013.01); C08G 59/4064 (2013.01); C08G 59/5033 (2013.01); C08G 59/688 (2013.01)]

11 Claims

1. An epoxy resin, comprising at least one compound selected from the group consisting of the following General Formulae (E1) and (E2):

wherein, in General Formulae (E1) and (E2), Ar represents a substituted or unsubstituted aromatic ring; each of R1 and R2 independently represents a monovalent organic group having a glycidyl group, wherein at least one selected from the group consisting of R₁and R2 includes a mesogenic structure; and each R3 independently represents a hydrogen atom or a monovalent organic group, at least one R3 being a monovalent organic group of the following Formula (c):

wherein, in Formula (c), R₄represents a monovalent organic group; and * represents a bonding site to an oxygen atom.

9. An epoxy resin composition, comprising the epoxy resin according to claim 1 and a curing agent.

10. An epoxy resin cured product, which is a cured product of the epoxy resin composition according to claim 9.

11. A composite material comprising the epoxy resin cured product according to claim 10 and a reinforcing material.