US 12,116,268 B2
MEMS device with improved dynamic mechanical performance through damping by localized viscoelastic medium
Stefan Richter, Jena (DE); Johannes Kindt, Weimar (DE); and Veljko Milanovic, Richmond, CA (US)
Filed by Mirrorcle Technologies, Inc.
Filed on Aug. 25, 2023, as Appl. No. 18/238,021.
Application 18/238,021 is a continuation of application No. 17/940,770, filed on Sep. 8, 2022, granted, now 11,772,959.
Application 17/940,770 is a continuation of application No. 16/632,511, granted, now 11,472,697, issued on Oct. 18, 2022, previously published as PCT/EP2018/068892, filed on Jul. 12, 2018.
Claims priority of provisional application 62/535,390, filed on Jul. 21, 2017.
Claims priority of application No. 10201707002.4 (DE), filed on Jul. 21, 2017.
Prior Publication US 2023/0399224 A1, Dec. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B81B 3/00 (2006.01); H02N 1/00 (2006.01)
CPC B81B 3/0078 (2013.01) [H02N 1/008 (2013.01); B81B 2201/04 (2013.01); B81B 2203/0154 (2013.01); B81B 2203/058 (2013.01)] 33 Claims
OG exemplary drawing
 
1. A MEMS device, comprising:
a substrate;
a suspended element connected to a fixed part of the substrate by one or more flexures,
wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate;
a sensor coupled to the suspended element;
a damping structure coupled to the suspended element extending into a gap between the suspended element and the fixed part of the substrate; and
one or more fluid confinement structures configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.